Mask, glass substrate and manufacturing method thereof

ABSTRACT

A manufacturing method of a glass substrate is provided, in which a mask including a light-blocking area, a transparent area and a partial-transparent area is adopted. The partial-transparent area protrudes from edges of the light-blocking area to admit some of the UV rays to pass through. In addition, a glass substrate manufactured with the method is also disclosed. By arranging the partial-transparent area on the edges of the light-blocking area, the mask is formed with a slope having a small angle after a lithography process. As such, in an etching process, an edge of a thin film is formed with a slope having a small angle, which contributes to the formation of a second thin film. The thin films are prevented from being fragmented around the slope and the ITO layer is also prevented from fragmented around the periphery of the through hole.

CROSS REFERENCE TO RELATED APPLICATIONS

This is a divisional application of co-pending patent application Ser. No. 13/985,596, filed on Aug. 15, 2013.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present disclosure relates to liquid crystal display technology, and more particularly to a mask, a glass substrate and a manufacturing method thereof.

2. The Related Arts

With the advanced technology, demands toward display devices have contributed to a rapid revolution of liquid crystal displays (LCDs). The main targets include improving the quality, reducing the defective rate, and saving the cost.

Currently, the array lithography process has certain requirement regarding the thickness of the photoresist. The thicker photoresist results in high cost, and the thinner photoresist results in a higher risk, i.e., the photoresist film may break off.

FIG. 1 is a partial view of a conventional mask. FIG. 2 is a schematic view showing the mask of FIG I after the exposure process and the lithography process. As shown in FIGS. 1 and 2, the mask includes a light-blocking area 11 and a transparent area (not labeled) outside of the light-blocking area 1. By using the mask shown in FIG. 1 to perform the exposure process and the lithography process, a photoresist 21 is formed on the thin film 22 as shown in FIG. 2.

FIG. 3 is a schematic view of the photoresist and the thin film of FIG. 2 after the etching process. By concurrently etching the photoresist 21 and the thin film 22 with the photo-resist peeling method, edges of the thin film 22 are shown as slopes with a large angle. The location 22′ may effect the formation of the third thin film and the indium tin oxide (ITO) layer around the through hole. For example, the third thin film may fragment around the slope, and the ITO may also fragment around the periphery of the through hole, which both result in a high defective rate.

SUMMARY

An object of the invention is to provide a mask, a glass substrate and a manufacturing method thereof to solve the above-mentioned problems.

In one aspect, a mask includes: a light-blocking area; a transparent area; a partial-transparent area; wherein the partial-transparent area protrudes from edges of the light-blocking area to admit some of the UV rays to pass through.

The mask further comprises a metallic sheet and an organic film, wherein the light-blocking area and the transparent area are formed on the metallic sheet, the organic film adheres to the metallic sheet, and the organic film protrudes from the edges of the light-blocking area with a predetermined width.

The transmission rate of the organic film is in the ranges of between 10% to 90%, 20% to 80%, 30% to 70%, and 40% to 60%, or the transmission rate of the organic film is 45%, 50%, or 55%.

The transparency rate of the organic film changes from the edges of the light-blocking area, wherein the change may be a gradual increase, a gradual decrease, or a plurality of gradual increases together with gradual decreases such that the change of the transparent rate looks like a wave-shaped or a sawtooth-shaped transition.

A dimension of the organic film is larger than the dimension of the light-blocking area, and the organic film fully covers the light-blocking area and also protrudes from the edges of the light-blocking area.

An engaging frame is arranged between the organic film and the light-blocking area.

The organic film adheres to an upper or a lower surface of the metallic sheet.

In another aspect, a manufacturing method of a glass substrate includes cleaning the glass substrate; depositing at least one thin film on the glass substrate; coating photoresist on the glass substrate; applying an exposure process to the glass substrate with a mask comprising a light-blocking area, a transparent area, and a partial-transparent area, wherein the partial-transparent area protrudes from edges of the light-blocking area to admit some of the UV rays to pass through; applying a lithography process to the glass substrate; applying an etching process to the glass substrate; applying a film-striping process to the glass substrate; and cutting the glass substrate.

In another aspect, a glass substrate includes: an exposed area, an unexposed area, and a partial exposed area extending outward from the edges of the unexposed area, wherein the glass substrate is manufactured by adopting a mask comprising a light-blocking area, a transparent area, and a partial-transparent area, wherein the partial-transparent area protrudes from edges of the light-blocking area to admit some of the UV rays to pass through.

After applying a lithography process to the glass substrate, the thickness of the partial exposed area changes from the edges of the unexposed area, wherein the change may be a gradual increase, a gradual decrease, or a plurality of gradual increases together with gradual decreases such that the change of the thickness looks like a wave-shaped or a sawtooth-shaped transition, and when the glass substrate is etched, edges of the thin film is formed as a slope with a small angle.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a partial view of a conventional mask.

FIG. 2 is a schematic view showing the mask of FIG. 1 after an exposure process and a lithography process.

FIG. 3 is a schematic view of the pattern of FIG. 2 an etching process.

FIG. 4 is a partial view of a mask in accordance with one embodiment.

FIG. 5 is a schematic view showing the mask of FIG. 4 after the exposure process and the lithography process.

FIG. 6 is a schematic view of the pattern of FIG. 5 after the etching process.

FIG. 7 is a top view of the mask above the through hole in accordance with one embodiment.

FIG. 8 is a schematic view of the pattern of FIG. 7 after the lithography process.

FIG. 9 is a flowchart illustrating a manufacturing method of the glass substrate in accordance with one embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Embodiments of the invention will now be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown.

FIG. 4 is a partial view of a mask in accordance with one embodiment. The mask is for blocking ultraviolet (UV) rays in an exposure step of a substrate manufacturing process. The mask includes a light-blocking area 12, a transparent area and a partial-transparent area 13. The partial-transparent area 13 protrudes from edges of the light-blocking area 12 to admit some of the UV rays to pass through. The transparent area (not labeled) is arranged outside the partial-transparent area 13.

Specifically, the mask includes a metallic sheet and an organic film. The light-blocking area 12 and the transparent area are formed on the metallic sheet. The organic film adheres to the metallic sheet. The organic film protrudes from the edges of the light-blocking area 12 with a predetermined width.

In one embodiment, the dimension of the manic film is larger than that of the light-blocking area 12. The organic film fully covers the light-blocking area 12 and also protrudes from the edges of the light-blocking area 12.

In other embodiments, an engaging frame is arranged between the organic film and the light-blocking area 12. The organic film may adhere to an upper or a lower surface of the metallic sheet.

In one embodiment, the transmission rate of the organic film is in the ranges of between 10% to 90%, 20% to 80%, 30% to 70%, and 40% to 60%. In other embodiments, the transmission rate of the organic film is 45%, 50%, or 55%.

Furthermore, the transparency rate of the organic film changes from the edges of the light-blocking area 12. The change may be a gradual increase, a gradual decrease, or a plurality of gradual increases together with gradual decreases such that the change of the transparency rate looks like a wave-shaped or a sawtooth-shaped transition. With such a change, a second thin film can be easily formed on the organic film. In addition, a better friction can be achieved and the second thin film is prevented from being fragmented. Also, the ITO layer is also prevented from being fragmented around the periphery of the through hole so as to improve the defective rate.

FIG. 5 is a schematic view showing the mask of FIG. 4 after the exposure process and the lithography process. As shown, a photoresist 23 is formed on a thin film 24.

FIG. 6 is a schematic view of the pattern of FIG. 5 after the etching process. By adopting the photo-resist peeling method to etch the photoresist 23 and the thin film 24 of FIG. 5, the edges of the thin film 24 are formed with slopes 24′ with a small angle. The slopes 24′ contribute to the formation of a third thin film and the formation of the ITO layer around the periphery of the through hole. Also, the third thin film is prevented from being fragmented around the slope and the ITO layer is prevented from fragmented around the periphery of the through hole.

FIG. 7 is a top view of the mask above the through hole in accordance with one embodiment. FIG. 8 is a schematic view of the pattern of FIG. 7 after the lithography process.

As shown in FIG. 7, after applying the exposure process, an unexposed portion 25, a partial exposed area 26, and an exposed area 27 are formed on the mask.

As shown in FIG. 8, after applying the lithography process, the through hole 27′ is formed in the exposed area 27′; slopes 26′ with a small angle are formed in the partial exposed area 26; and the unexposed area 25 remains the same. In this way, the ITO layer is prevented from being fragmented around the periphery of the through hole 27′.

In one embodiment, the glass substrate manufactured by adopting the above mask in the exposure process includes the exposed area, the unexposed area, and the partial exposed area extending outward from the edges of the unexposed area.

In one embodiment, after applying the lithography process to the glass substrate, the thickness of the partial exposed area changes from the edges of the unexposed area. The change may be a gradual increase, a gradual decrease, or a plurality of gradual increases together with gradual decreases such that the change of the thickness looks like a wave-shaped or a sawtooth-shaped transition. In this way, when the glass substrate is etched, the edges of the thin film are formed as slopes with a small angle.

FIG. 9 is a flowchart illustrating a manufacturing method of the glass substrate in accordance with one embodiment. The method includes the following steps. In step S110, the glass substrate is cleaned. In step S120, thin films are deposited on the glass substrate. In step S130, photoresist is coating on the glass substrate. In step S140, a mask is adopted to perform an exposure process on the glass substrate. In step S150, a lithography process is applied to the glass substrate. In step S160, an etching process is applied to the glass substrate. In step S170, a film striping process is applied to the glass substrate. In step S180, the glass substrate is cut.

In view of the above, by arranging the partial-transparent area 13 on the edges of the light-blocking area 12, the mask is formed with slopes having a small angle after the lithography process. As such, in an etching process, the edge of the thin film is formed with a slope having a small angle, which contributes to the formation of the second thin film. The thin films are prevented from being fragmented around the slope and the ITO layer is also prevented from fragmented around the periphery of the through hole.

It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages. The examples that are described hereinbefore are merely preferred or exemplary embodiments of the invention. 

What is claimed is:
 1. A method for processing a glass substrate, comprising: cleaning the glass substrate; depositing at least one thin film on the glass substrate; coating photoresist on the glass substrate to cover the thin film; applying an exposure process to the photoresist on the glass substrate with a mask comprising a light-blocking area, a transparent area, and a partial-transparent area, wherein the partial-transparent area protrudes beyond edges of the light-blocking area to admit light to pass therethrough; wherein the mask comprises a metallic sheet that forms the light-blocking area and the organic film adheres to the metallic sheet, such that a portion of the organic film protrudes outside the edges of the light-blocking area with a predetermined width to define the partial-transparent area that protrudes beyond the edges of the light blocking area, the transparent area being located outside the partial-transparent area; and wherein a dimension of the organic film is larger than the dimension of the light-blocking area, and the organic film fully covers the light-blocking area and also protrudes from the edges of the light-blocking area; applying a process to the glass substrate to convert the photoresist into a pattern of photoresist; applying an etching process to the thin film on the glass substrate according to the pattern of the photoresist so as form a pattern of the thin film on the substrate.
 2. The method as claimed in claim 1, wherein the organic film has a transmission rate in the ranges of between 10% to 90%, 20% to 80%, 30% to 70%, and 40% to 60%, or the transmission rate of the organic film is 45%, 50%, or 55%.
 3. The method as claimed in claim 2, wherein the transmission rate of the organic film changes from the edges of the light-blocking area, wherein the change is a gradual increase, a gradual decrease, or a plurality of gradual increases together with gradual decreases such that the change of the transmission rate shows a wave-shaped or a sawtooth-shaped transition.
 4. The method as claimed in claim 1, wherein an engaging frame is arranged between the organic film and the light-blocking area.
 5. The method as claimed in claim 1, wherein the organic film adheres to an upper surface or a lower surface of the metallic sheet. 